Part Number | XCZU7EV-3FBVB900E |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | AMD |
Description | IC FPGA 204 I/O 900FCBGA |
Series | Zynq UltraScale+,MPSoC EV |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Quad ARM Cortex-A53 MPCore,with CoreSight, Dual ARMCortex,R5 with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA, WDT |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 600MHz, 1.5GHz |
Speed | ZynqUltraScale+,FPGA, 504K+ Logic Cells |
Primary Attributes | 0°C ~ 100°C (TJ) |
Operating Temperature | 900-BBGA, FCBGA |
Package / Case | 900-FCBGA (31x31) |
Supplier Device Package | |
Image |
XCZU7EV-3FBVB900E
AMD
972
1.29
HK HEQING ELECTRONICS LIMITED
XCZU7EV-3FBVB900E
AMD/LATTICE
6150
1.9125
Hong Kong One Core Century Technology Co., Limited
XCZU7EV-3FBVB900E
AMD (Advanced Micro Devices)
2000
2.535
TENYU Electronics (HongKong) Co., Limited
XCZU7EV-3FBVB900E
AMD/SPANSION
1000
3.1575
HK Hongtaiyu Electron Limited
XCZU7EV-3FBVB900E
AMD
5400
3.78
MOUSERWEI ELECTRONIC (HK) LIMITED