Part Number | XCZU4EV-3FBVB900E |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | AMD |
Description | IC FPGA 204 I/O 900FCBGA |
Series | Zynq UltraScale+,MPSoC EV |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Quad ARM Cortex-A53 MPCore,with CoreSight, Dual ARMCortex,R5 with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA, WDT |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 600MHz, 1.5GHz |
Speed | ZynqUltraScale+,FPGA, 192K+ Logic Cells |
Primary Attributes | 0°C ~ 100°C (TJ) |
Operating Temperature | 900-BBGA, FCBGA |
Package / Case | 900-FCBGA (31x31) |
Supplier Device Package | |
Image |
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XCZU4EV-3FBVB900E
AMD
2000
5.24
Y.H.X ELECTRONIC TECHNOLOGY HK LIMITED
XCZU4EV-3FBVB900E
AMD
2000
1.16
TENYU Electronics (HongKong) Co., Limited
XCZU4EV-3FBVB900E
AMD/LATTICE
169
2.18
Xian Neng Technology (Hongkong) International Limited
XCZU4EV-3FBVB900E
AMD (Advanced Micro Devices)
300
3.2
RX ELECTRONICS LIMITED
XCZU4EV-3FBVB900E
AMD/SPANSION
5400
4.22
MOUSERWEI ELECTRONIC (HK) LIMITED