Part Number | XCZU11EG-3FFVC1760E |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | AMD |
Description | IC FPGA 512 I/O 1760FCBGA |
Series | Zynq UltraScale+,MPSoC EG |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Quad ARM Cortex-A53 MPCore,with CoreSight, Dual ARMCortex,R5 with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA, WDT |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 600MHz, 1.5GHz |
Speed | ZynqUltraScale+,FPGA, 653K+ Logic Cells |
Primary Attributes | 0°C ~ 100°C (TJ) |
Operating Temperature | 1760-BBGA, FCBGA |
Package / Case | 1760-FCBGA (42.5x42.5) |
Supplier Device Package | |
Image |
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XCZU11EG-3FFVC1760E
AMD/SPANSION
3340
3.8
ENSPIRE TECHNOLOGY (HONG KONG) CO., LIMITED
XCZU11EG-3FFVC1760E
AMD
2000
4.64
Y.H.X ELECTRONIC TECHNOLOGY HK LIMITED
XCZU11EG-3FFVC1760E
AMD
6150
1.28
Hong Kong One Core Century Technology Co., Limited
XCZU11EG-3FFVC1760E
AMD/LATTICE
83
2.12
Xian Neng Technology (Hongkong) International Limited
XCZU11EG-3FFVC1760E
AMD (Advanced Micro Devices)
2000
2.96
TENYU Electronics (HongKong) Co., Limited