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powered by HKIN - Datasheet (Result Page) About 2 results (0.33 seconds) Web (2) DS892 DS892 Feb 2, 2017 XCKU085 . 3181. 2893. 2893. 2893. 2631. mA. XCKU095. N/A. 2100. 2100. N/A. N/A. mA. XCKU115. 3181. 2893. 2893. 2893. 2631. mA. clipped from Google - 8/2017 UltraScale Architecture and Product Data Sheet: Overview (DS890) UltraScale Architecture and Product Data Sheet: Overview (DS890) Feb 15, 2017 Xilinx UltraScale architecture comprises high-performance FPGA and MPSoC families that address a vast spectrum of system requirements clipped from Google - 8/2017 1 powered by Custom Search HKIPortal_resize(); HKIPortal_attachEvent(window, load, HKIPortal_resize); HKIPortal_attachEvent(window, load, HKIPortal_onLoad); reviews - - cal - Price range: Availability: . Price: . - - = tn.height * 7 / 5 data-attr={src:tn.src}>
| Part Number | XCKU0852FLVB1760I |
| Main Category | Integrated Circuits (ICs) |
| Sub Category | Embedded - FPGAs (Field Programmable Gate Array) |
| Brand | AMD |
| Description | IC FPGA 676 I/O 1760FCBGA |
| Series | Kintex UltraScale |
| Number of LABs/CLBs | 62190 |
| Number of Logic Elements/Cells | 1088325 |
| Total RAM Bits | 58265600 |
| Number of I/O | 676 |
| Number of Gates | - |
| Voltage - Supply | 0.922 V ~ 0.979 V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| Image |  |
XCKU085-2FLVB1760I
AMD
1000
0.69
HK HEQING ELECTRONICS LIMITED
XCKU085-2FLVB1760I
AMD/LATTICE
76
1.4
Xian Neng Technology (Hongkong) International Limited
XCKU085-2FLVB1760I
AMD (Advanced Micro Devices)
143
2.11
Lansheng Technology Co.,Ltd.
XCKU085-2FLVB1760I
AMD/SPANSION
57
2.82
E-CORE COMPONENT CO., LIMITED
XCKU085-2FLVB1760I
AMD
6150
3.53
Hong Kong One Core Century Technology Co., Limited
