Description
IC SOC CORTEX-A9 KINTEX7 676BGA Series: Zynq?-7000 Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? MCU Flash: - MCU RAM: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells Operating Temperature: -40~C ~ 100~C Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)
Part Number | XC7Z030-L2FBG676I |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | AMD |
Description | IC SOC CORTEX-A9 KINTEX7 676BGA |
Series | Zynq-7000 |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore,with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 800MHz |
Speed | Kintex,7 FPGA, 125K Logic Cells |
Primary Attributes | -40°C ~ 100°C (TJ) |
Operating Temperature | 676-BBGA, FCBGA |
Package / Case | 676-FCBGA (27x27) |
Supplier Device Package | |
Image |
XC7Z030-L2FBG676I
AMD
6150
0.05
Hong Kong One Core Century Technology Co., Limited
XC7Z030-L2FBG676I
AMD/LATTICE
2000
1.0275
TENYU Electronics (HongKong) Co., Limited
XC7Z030-L2FBG676I
AMD (Advanced Micro Devices)
150
2.005
UCAN TRADE (HK) LIMITED
XC7Z030-L2FBG676I
AMD/SPANSION
667
2.9825
Xian Neng Technology (Hongkong) International Limited
XC7Z030-L2FBG676I
AMD
1000
3.96
CIS Ltd (CHECK IC SOLUTION LIMITED)