AMD

Description

Aug 1, 2017 GTXs. XADC. Blocks. Total I/O. Banks(6). Max. User. I/O(7). Slices(1). Max. Distributed. RAM (Kb). 18 Kb. 36 Kb. Max (Kb). XC7K70T. 65,600. 10,250. 838. 240. 270. 135. 4,860. 6. 1. 8. 1. 6. 300. XC7K160T. 162,240. 25,350. 2,188. 600. 650. 325. 11,700. 8. 1. 8. 1. 8. 400. XC7K325T . 326,080. 50,950. 4,000. Oct 31, 2016 For information on how to sign up, refer to Xilinx Answer Record 18683. Revision History. The following table shows the revision history for this document. Date. Version. Revision. 10/31/16. 1.0. Initial release. Taiwan. KKN2W1.00 CF1234567A 1519. XILINX . KINTEX-7. XC7K325T . FFG676ABC1519. May 8, 2017 Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics. DS182 (v2.16 ) May 8, 2017 www.xilinx.com. Product Specification. 6. ICCOQ. Quiescent VCCO supply current. XC7K70T. 1. 1. 1. N/A. N/A. N/A. 1. mA. XC7K160T. 1. 1. 1. N/A. N/ A. 1. 1. mA. XC7K325T . 1. 1. 1. N/A. N/A. 1. 1. mA. XC7K355T. Jul 24, 2017 Figure 4-28: XC7K325T FB676, FBG676, and FBV676 Die Dimensions with Capacitor. Locations. Figure 4-29: XC7K410T FB676, FBG676, and FBV676 Die Dimensions with Capacitor. Locations. Figure 4-30: FB900, FBG900, and FBV900 Flip-Chip Lidless BGA Package. Specifications for Kintex-7 FPGAs. Oct 31, 2012 KC705 evaluation board featuring the XC7K325T - 2FFG900C FPGA. USB cables, Ethernet cable, and universal power supply. SD card. Xilinx Design Tools (device-locked for the XC7K325T - 2FFG900C FPGA) which includes: ISE Foundation with ISE Simulator. PlanAhead and Vivado design