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Description
Dec 15, 2016 XC7K325T . 326,080. 50,950. 4,000. 840. 890. 445. 16,020. 10. 1. 16. 1. 10. 500. XC7K355T. 356,160. 55,650. 5,088. 1,440. 1,430. 715. 25,740. Mar 23, 2016 Figure 4-21: XC7K325T FB676, FBG676, and FBV676 Die Dimensions with Figure 4-24: XC7K325T FB900, FBG900, and FBV900 Die Nov 24, 2015 838. mA. ICCOQ. Quiescent VCCO supply current. XC7K70T. 1. 1. 1. N/A. N/A. N/ A. 1. mA. XC7K160T. 1. 1. 1. N/A. N/A. 1. 1. mA. XC7K325T . 1. Sep 10, 2013 Page 1. WP372 (v1.2) October 27, 2014 www.xilinx.com. 1. Copyright 2013 2014 Xilinx, Inc., Xilinx, the Xilinx logo, Artix, ISE, Kintex, Page 1. Zynq-7000. All Programmable SoC. Packaging and Pinout. Product Specification. UG865 (v1.6) March 1, 2016. Page 2
| Part Number | XC7K325T1FBG676I |
| Main Category | Integrated Circuits (ICs) |
| Sub Category | Embedded - FPGAs (Field Programmable Gate Array) |
| Brand | AMD |
| Description | IC FPGA 400 I/O 676FCBGA |
| Series | Kintex-7 |
| Number of LABs/CLBs | 25475 |
| Number of Logic Elements/Cells | 326080 |
| Total RAM Bits | 16404480 |
| Number of I/O | 400 |
| Number of Gates | - |
| Voltage - Supply | 0.97 V ~ 1.03 V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Image |  |
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