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Description
Aug 30, 2010 XC4VLX25 . 96 x 28. 24,192. 10,752. 168. 48. 72. 1,296. 8. 4. N/A. N/A. N/A. 11. 448. XC4VLX40. 128 x 36. 41,472. 18,432. 288. 64. 96. 1,728. 8. Sep 9, 2009 Device. Typ(1). Max. Units. ICCINTQ. Quiescent VCCINT supply current. XC4VLX15. 46. Note (6). mA. XC4VLX25 . 77. Note (6). mA. XC4VLX40. Dec 5, 2011 Since the introduction of Virtex-4 and Virtex-5 FPGA products, Xilinx has qualified both product families in both. Toshiba, in Oita, Japan, and May 1, 2006 A new thermal lid adhesive has been qualified for use on all flip-chip packages. The dual purpose material provides a thermal path between Sep 19, 2008 As shown in Table 2-1, Virtex-4 XC4VLX15, XC4VLX25 , and XC4VFX12 devices are available in the SF363 flip-chip fine-pitch BGA package.
| Part Number | XC4VLX2510FFG668C |
| Main Category | Integrated Circuits (ICs) |
| Sub Category | Embedded - FPGAs (Field Programmable Gate Array) |
| Brand | AMD |
| Description | IC FPGA 448 I/O 668FCBGA |
| Series | Virtex-4 LX |
| Number of LABs/CLBs | 2688 |
| Number of Logic Elements/Cells | 24192 |
| Total RAM Bits | 1327104 |
| Number of I/O | 448 |
| Number of Gates | - |
| Voltage - Supply | 1.14 V ~ 1.26 V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 668-BBGA, FCBGA |
| Supplier Device Package | 668-FCBGA (27x27) |
| Image |  |
Hot Offer
XC4VLX25-10FFG668C
AMD
3332
1.4
ENSPIRE TECHNOLOGY (HONG KONG) CO., LIMITED
XC4VLX25-10FFG668C
AMD/LATTICE
12000
2.1925
Boly Electronics (Hongkong) Co., Limited
XC4VLX25-10FFG668C
AMD (Advanced Micro Devices)
5000
2.985
HITO TECHNOLOGY LIMITED
XC4VLX25-10FFG668C
AMD/SPANSION
3768
3.7775
Xian Neng Technology (Hongkong) International Limited
XC4VLX25-10FFG668C
AMD
130
4.57
Zhaoxin Electronic Limited
